Title: Advanced Materials and Technology Engineer – PCB Technology Focus
Location: Nashua, NH
Amphenol’s High-Speed Backplane Connector business unit is seeking a highly specialized technical expert to help define and develop the future of copper-based backplane interconnect technology. This role is focused on enabling the next generation of high-speed signal transmission in backplane architectures, with a long-term goal of achieving 448G and beyond performance using copper backplane connectors.
The ideal candidate will be a hands-on technical leader with deep expertise in PCB fabrication technology and PCB materials, substrate and package fabrication, signal integrity and high-speed interconnect design. This individual will serve as a key subject matter expert on the PCB and its interaction with connector and system-level architecture, helping bridge the gap between emerging technology concepts and practical product development.
Responsibilities:
- Work closely with external PCB suppliers to influence industry direction and future product requirements.
- Provide technical guidance and mentorship across engineering teams on PCB and backplane-related topics.
- Support customer engagements by translating advanced technical concepts/needs into practical design recommendations.
- Lead research and development efforts focused on the future of copper in backplane connector systems.
- Serve as the technical expert on PCB design, material selection, stack-up optimization, and electrical performance as it relates to connector integration.
- Investigate, define, and evaluate new architectures and technology concepts that may not yet exist in the market.
- Collaborate cross-functionally with product development, systems engineering, signal integrity, materials, manufacturing, and customer-facing technical teams.
- Lead the modeling, prototyping and validation advanced PCB stack up solutions for high-speed applications with our external partners.
- Identify technical barriers and create development roadmaps to overcome limitations in copper-based transmission.
Qualifications:
- Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a closely related technical field.
- Extensive experience in high-speed PCB fabrication, signal integrity, and/or advanced interconnect development.
- Strong background in backplane architecture and copper transmission systems.
- Substrate and package fabrication knowledge is a plus.
- Demonstrated expertise in PCB technology and how it impacts end-to-end electrical performance.
- Ability to evaluate emerging technologies and develop forward-looking technical strategies.
- Excellent analytical, problem-solving, and cross-functional collaboration skills.
- Experience with 56G, 112G, 224G, 448G, or similarly advanced high-speed signaling environments is a plus.
- Background in connector development, high-speed channel design, or advanced package/board-level integration is a plus.
Ideal Candidate Profile
- Recognized technical expert in PCB and high-speed signal transmission.
- Comfortable working on problems where the solution does not yet fully exist.
- Passionate about enabling the future of copper interconnect performance.
- Able to think strategically while remaining deeply engaged in technical detail.
- Thrives in a collaborative environment that values innovation, rigor, and execution.
Why Join Us
- This is a unique opportunity to shape the future of high-speed backplane connectivity at Amphenol. You will work on cutting-edge technology that pushes the limits of what copper can achieve and help define the roadmap for next-generation systems.